XU, Li Ming; ZHAO, Jian Feng. TECHNOLOGICAL FUSION: IN-DEPTH ANALYSIS OF MECHATRONICS AND ELECTRONIC CHIPS . International Journal of Civil Engineering and Architecture and Real Estate, [S. l.], v. 10, n. 3, p. 14–22, 2024. Disponível em: https://aydenjournals.com/index.php/IJCEARE/article/view/703. Acesso em: 23 aug. 2025.